LTCC in microelectronics, microsystems, and sensors

Low Temperature Cofired Ceramic (LTCC) is one of the most significant developments in microelectronics, microsystems, and sensors integration. The formerly-flat board technology involves a materials and process suite that lends itself to shaped and stacked 3D packaging and, within the board, enclosed unfilled volumes and unconventional components. The documentation of LTCC microsystem and sensor applications is growing rapidly in the literature. This paper will discuss accomplishments at Sandia in RF, microfluidics, gas handling, microsystems, and sensor applications. Highlighted areas include Radar MCMs, biological microsystems, smart channels, and new sensor geometries including rolled ceramic tubular substrates. Unconventional processing techniques for creating unfilled open volumes such as SVMs, screeding, and use of inserts with and without prior cavity definition will be discussed. New applications, such as the use of magnetic bead capture, incorporated smart channels, microthrusters, micro-NMR devices, radiation detectors, IMS drift tubes, optical microphones and optical switch packaging and improved performance from Full Tape Thickness Features (FTTF) will also be discussed.