DocumentCode
475461
Title
E-cubes devices and interconnects - integrated modeling and simulation for reliability analysis
Author
Bieniek, T. ; Janczyk, Grzegorz ; Janus, P. ; Grabiec, P. ; Szynka, J.
Author_Institution
Institute of Electron Technology, Warsaw, POLAND
fYear
2008
fDate
19-21 June 2008
Firstpage
407
Lastpage
411
Abstract
In this paper we present the selected FEM simulations results of the 3D models of the vertically integrated silicon dies — the e-Cubes device. The detailed analysis of the specified chip interconnects based on the Cea-LETI micro-insert technology are also included.
Keywords
Analytical models; Assembly; Biosensors; Computational modeling; Computer simulation; Electrons; Silicon; Thermal management; Thermal stresses; Wireless sensor networks; 3D integration; Interconnects; Modeling; Reliability; Simulation; e-Cubes;
fLanguage
English
Publisher
iet
Conference_Titel
Mixed Design of Integrated Circuits and Systems, 2008. MIXDES 2008. 15th International Conference on
Conference_Location
Poznan, Poland
Print_ISBN
978-83-922632-7-2
Electronic_ISBN
978-83-922632-8-9
Type
conf
Filename
4600945
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