Title :
E-cubes devices and interconnects - integrated modeling and simulation for reliability analysis
Author :
Bieniek, T. ; Janczyk, Grzegorz ; Janus, P. ; Grabiec, P. ; Szynka, J.
Author_Institution :
Institute of Electron Technology, Warsaw, POLAND
Abstract :
In this paper we present the selected FEM simulations results of the 3D models of the vertically integrated silicon dies — the e-Cubes device. The detailed analysis of the specified chip interconnects based on the Cea-LETI micro-insert technology are also included.
Keywords :
Analytical models; Assembly; Biosensors; Computational modeling; Computer simulation; Electrons; Silicon; Thermal management; Thermal stresses; Wireless sensor networks; 3D integration; Interconnects; Modeling; Reliability; Simulation; e-Cubes;
Conference_Titel :
Mixed Design of Integrated Circuits and Systems, 2008. MIXDES 2008. 15th International Conference on
Conference_Location :
Poznan, Poland
Print_ISBN :
978-83-922632-7-2
Electronic_ISBN :
978-83-922632-8-9
