Circular pattern extraction in wafer fault mining

Author

Ma, Jie ; Zhao, Quan-ming

Author_Institution

Dept. of Inf. Eng., Hebei Univ. of Technol., Tianjin

Volume

1

fYear

2008

fDate

30-31 Aug. 2008

Firstpage

123

Lastpage

127

Abstract

A method on circular pattern measurement in wafer fault pattern retrieval system is developed. It can help engineers to query circular wafer fault pattern to historical or other patterns for manufacturing fault detection and tracking. An enclosing polygon based on the vertices of boundary edges is constructed to describe the border of circular pattern. Experimental results show that the proposed approach improves the accuracy and effectiveness of circularity measurement.

Keywords

computational geometry; data mining; edge detection; fault diagnosis; feature extraction; image retrieval; semiconductor device manufacture; boundary edge construction; circular pattern extraction; circular wafer fault pattern querying; manufacturing fault detection; manufacturing fault tracking; polygon; semiconductor industry; wafer fault mining; wafer fault pattern retrieval system; Area measurement; Data mining; Feature extraction; Pattern analysis; Pattern matching; Pattern recognition; Pollution measurement; Shape measurement; Testing; Wavelet analysis; Circularity; Image retrieval; Low resolution; Wafer fault pattern; Yield;

fLanguage

English

Publisher

ieee

Conference_Titel

Wavelet Analysis and Pattern Recognition, 2008. ICWAPR '08. International Conference on

Conference_Location

Hong Kong

Print_ISBN

978-1-4244-2238-8

Electronic_ISBN

978-1-4244-2239-5

Type

conf

DOI

10.1109/ICWAPR.2008.4635762

Filename

4635762