Title :
Circular pattern extraction in wafer fault mining
Author :
Ma, Jie ; Zhao, Quan-ming
Author_Institution :
Dept. of Inf. Eng., Hebei Univ. of Technol., Tianjin
Abstract :
A method on circular pattern measurement in wafer fault pattern retrieval system is developed. It can help engineers to query circular wafer fault pattern to historical or other patterns for manufacturing fault detection and tracking. An enclosing polygon based on the vertices of boundary edges is constructed to describe the border of circular pattern. Experimental results show that the proposed approach improves the accuracy and effectiveness of circularity measurement.
Keywords :
computational geometry; data mining; edge detection; fault diagnosis; feature extraction; image retrieval; semiconductor device manufacture; boundary edge construction; circular pattern extraction; circular wafer fault pattern querying; manufacturing fault detection; manufacturing fault tracking; polygon; semiconductor industry; wafer fault mining; wafer fault pattern retrieval system; Area measurement; Data mining; Feature extraction; Pattern analysis; Pattern matching; Pattern recognition; Pollution measurement; Shape measurement; Testing; Wavelet analysis; Circularity; Image retrieval; Low resolution; Wafer fault pattern; Yield;
Conference_Titel :
Wavelet Analysis and Pattern Recognition, 2008. ICWAPR '08. International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-2238-8
Electronic_ISBN :
978-1-4244-2239-5
DOI :
10.1109/ICWAPR.2008.4635762
