Title :
An Ultrasonic System for Detecting Channel Defects in Flexible Packages
Author :
He, Cunfu ; Yuan, Hongmei ; Wu, Bin ; Song, Guorong
Author_Institution :
Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing
Abstract :
Ultrasonic system was developed for detecting channel defects embedded in bonded 2-sheet flexible packages film. This hardware system consisted of spherically focused 22.66-MHz ultrasonic transducer, four-axis precision positioning system, NI PXI-bus embedded controller and ultrasonic pulser-receiver. The software system was designed based on the modularization, realized the echo signal on-line processing using ultrasonic backscattered echo envelope integral (BEEI) imaging method. Some experimental results were presented, and the BEEI-mode imaging of channel defect was shown. The system can be easily used to detect the channel defects in flexible packages.
Keywords :
backscatter; electronics packaging; flexible electronics; ultrasonic transducers; NI PXI-bus embedded controller; bonded 2-sheet flexible packages film; channel defects; four-axis precision positioning system; frequency 22.66 MHz; ultrasonic backscattered echo envelope integral imaging method; ultrasonic pulser-receiver; ultrasonic system; ultrasonic transducer; Bonding; Control systems; Focusing; Hardware; Packaging; Signal design; Software design; Software systems; Ultrasonic imaging; Ultrasonic transducers;
Conference_Titel :
Intelligent Computation Technology and Automation (ICICTA), 2008 International Conference on
Conference_Location :
Hunan
Print_ISBN :
978-0-7695-3357-5
DOI :
10.1109/ICICTA.2008.251