DocumentCode
47826
Title
Connecting Silicon Photonic Circuits to Multicore Fibers by Photonic Wire Bonding
Author
Lindenmann, Nicole ; Dottermusch, Stephan ; Goedecke, Maria Laura ; Hoose, Tobias ; Billah, Muhammad Rodlin ; Onanuga, Temitope Paul ; Hofmann, Andreas ; Freude, Wolfgang ; Koos, Christian
Author_Institution
Inst. of Photonics & Quantum Electron., Karlsruhe Inst. of Technol., Karlsruhe, Germany
Volume
33
Issue
4
fYear
2015
fDate
Feb.15, 15 2015
Firstpage
755
Lastpage
760
Abstract
Photonic wire bonding is demonstrated to enable highly efficient coupling between multicore fibers and planar silicon photonic circuits. The technique relies on in-situ fabrication of three-dimensional interconnect waveguides between the fiber facet and tapered silicon-on-insulator waveguides. Photonic wire bonding can easily compensate inaccuracies of core placement in the fiber cross-section, does not require active alignment, and is well suited for automated fabrication. We report on the design, on fabrication, and on characterization of photonic wire bonds. In a proof-of-principle experiment, a four-core fiber is coupled to a silicon photonic chip, leading to measured coupling losses as small as 1.7 dB.
Keywords
integrated optics; lead bonding; optical fibre communication; optical fibre fabrication; optical fibre losses; optical interconnections; optical waveguides; silicon; silicon-on-insulator; Si; core placement; coupling losses; fiber cross-section; fiber facet; four-core fiber; in-situ fabrication; multicore fibers; photonic wire bonding; planar silicon photonic circuits; tapered silicon-on-insulator waveguides; three-dimensional interconnect waveguides; Insertion loss; Loss measurement; Optical fiber couplers; Photonics; Wires; Integrated optics; multi-core fibers; nanotechnology; optical fibers; optical interconnections; photonic wire bonding; silicon photonics; two-photon lithography; waveguides;
fLanguage
English
Journal_Title
Lightwave Technology, Journal of
Publisher
ieee
ISSN
0733-8724
Type
jour
DOI
10.1109/JLT.2014.2373051
Filename
6962897
Link To Document