DocumentCode :
47826
Title :
Connecting Silicon Photonic Circuits to Multicore Fibers by Photonic Wire Bonding
Author :
Lindenmann, Nicole ; Dottermusch, Stephan ; Goedecke, Maria Laura ; Hoose, Tobias ; Billah, Muhammad Rodlin ; Onanuga, Temitope Paul ; Hofmann, Andreas ; Freude, Wolfgang ; Koos, Christian
Author_Institution :
Inst. of Photonics & Quantum Electron., Karlsruhe Inst. of Technol., Karlsruhe, Germany
Volume :
33
Issue :
4
fYear :
2015
fDate :
Feb.15, 15 2015
Firstpage :
755
Lastpage :
760
Abstract :
Photonic wire bonding is demonstrated to enable highly efficient coupling between multicore fibers and planar silicon photonic circuits. The technique relies on in-situ fabrication of three-dimensional interconnect waveguides between the fiber facet and tapered silicon-on-insulator waveguides. Photonic wire bonding can easily compensate inaccuracies of core placement in the fiber cross-section, does not require active alignment, and is well suited for automated fabrication. We report on the design, on fabrication, and on characterization of photonic wire bonds. In a proof-of-principle experiment, a four-core fiber is coupled to a silicon photonic chip, leading to measured coupling losses as small as 1.7 dB.
Keywords :
integrated optics; lead bonding; optical fibre communication; optical fibre fabrication; optical fibre losses; optical interconnections; optical waveguides; silicon; silicon-on-insulator; Si; core placement; coupling losses; fiber cross-section; fiber facet; four-core fiber; in-situ fabrication; multicore fibers; photonic wire bonding; planar silicon photonic circuits; tapered silicon-on-insulator waveguides; three-dimensional interconnect waveguides; Insertion loss; Loss measurement; Optical fiber couplers; Photonics; Wires; Integrated optics; multi-core fibers; nanotechnology; optical fibers; optical interconnections; photonic wire bonding; silicon photonics; two-photon lithography; waveguides;
fLanguage :
English
Journal_Title :
Lightwave Technology, Journal of
Publisher :
ieee
ISSN :
0733-8724
Type :
jour
DOI :
10.1109/JLT.2014.2373051
Filename :
6962897
Link To Document :
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