DocumentCode
478572
Title
A Case Study on SW Product Line Architecture Evaluation: Experience in the Consumer Electronics Domain
Author
Kim, Kangtae ; Kim, Hyungrok ; Kim, Sundeok ; Chang, Gihun
Author_Institution
Samsung Electron., Suwon
fYear
2008
fDate
26-31 Oct. 2008
Firstpage
192
Lastpage
197
Abstract
A well-executed software architecture is one of the most critical factors for achieving the intended effectiveness of a software product line as a holistic picture of a system. Today, many organizations are investing in architecture and its quality attributes for productivity, time to market and etc. In this paper, we show an evaluation framework named which provides criteria for measuring execution (designing and implementing) of an architecture and guideline for improvement based on measurement, analysis and improvement principle. We focused on software architecture design itself because we are mainly concerned with design and implementation issues thus concentrating on the architecture criteria. The contribution of the paper is to identify and demonstrate a architecture analysis and improvement process with practical experimentation results. The framework is based on design attributes of product line architecture and static analysis of architecture implementation.
Keywords
consumer electronics; product development; productivity; software architecture; software process improvement; software reusability; consumer electronics; improvement process; product line architecture evaluation; productivity; software architecture; software product line; static analysis; Computer architecture; Consumer electronics; Documentation; Guidelines; Product design; Productivity; Software architecture; Software design; Software engineering; Time to market; product line; software architecture evaluation;
fLanguage
English
Publisher
ieee
Conference_Titel
Software Engineering Advances, 2008. ICSEA '08. The Third International Conference on
Conference_Location
Sliema
Print_ISBN
978-1-4244-3218-9
Electronic_ISBN
978-0-7695-3372-8
Type
conf
DOI
10.1109/ICSEA.2008.80
Filename
4668108
Link To Document