• DocumentCode
    478853
  • Title

    Correlation of On-Die capacitance for power delivery network

  • Author

    Liu, Yi-Feng ; Wang, Brian ; Xu, Mingming ; Xiaoping Liu ; Chen, Jie Zhu ; Desmith, Michael

  • Author_Institution
    Intel Corp., Chandler, AZ
  • fYear
    2008
  • fDate
    27-29 Oct. 2008
  • Firstpage
    123
  • Lastpage
    126
  • Abstract
    On-die capacitance is critical parameter in power delivery analysis and design, which impacts design cost and system performance. To improve modeling accuracy, correlation was studied for on-die capacitance among internal algorithm/tool, on-die PDA, Apachepsilas RedHawk and lab measurement. Internal tool, on-die PDA is a tool to automatically simulate on-die models including Cdie, Rdie and Icc(t). RedHawk is a commercial tool by Apache Design Solution Inc. to simulate silicon power/ground noise, and generate on-die models with chip power model (CPM) feature. Measurement was conducted in frequency domain by VNA. In general, three approaches agree with each other reasonably, however, discrepancies come from the limitations of the methods. In this paper, the procedures of these 3 approaches are described. The pros and cons are analyzed, and recommendations are proposed.
  • Keywords
    capacitance; frequency-domain analysis; network synthesis; Apache Design Solution Inc; RedHawk; chip power model; frequency domain analysis; on-die capacitance correlation; power delivery network; Capacitance measurement; Costs; Frequency measurement; Noise generators; Performance analysis; Power generation; Power system modeling; Semiconductor device measurement; Silicon; System performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2873-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2008.4675893
  • Filename
    4675893