DocumentCode
478853
Title
Correlation of On-Die capacitance for power delivery network
Author
Liu, Yi-Feng ; Wang, Brian ; Xu, Mingming ; Xiaoping Liu ; Chen, Jie Zhu ; Desmith, Michael
Author_Institution
Intel Corp., Chandler, AZ
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
123
Lastpage
126
Abstract
On-die capacitance is critical parameter in power delivery analysis and design, which impacts design cost and system performance. To improve modeling accuracy, correlation was studied for on-die capacitance among internal algorithm/tool, on-die PDA, Apachepsilas RedHawk and lab measurement. Internal tool, on-die PDA is a tool to automatically simulate on-die models including Cdie, Rdie and Icc(t). RedHawk is a commercial tool by Apache Design Solution Inc. to simulate silicon power/ground noise, and generate on-die models with chip power model (CPM) feature. Measurement was conducted in frequency domain by VNA. In general, three approaches agree with each other reasonably, however, discrepancies come from the limitations of the methods. In this paper, the procedures of these 3 approaches are described. The pros and cons are analyzed, and recommendations are proposed.
Keywords
capacitance; frequency-domain analysis; network synthesis; Apache Design Solution Inc; RedHawk; chip power model; frequency domain analysis; on-die capacitance correlation; power delivery network; Capacitance measurement; Costs; Frequency measurement; Noise generators; Performance analysis; Power generation; Power system modeling; Semiconductor device measurement; Silicon; System performance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675893
Filename
4675893
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