• DocumentCode
    479364
  • Title

    Study on Dynamic Relationship between Independent Technology Standards and Technological Innovation

  • Author

    Shiming Wang ; Ting Xu

  • Author_Institution
    Sch. of Manage., Dalian Univ. of Technol., Dalian
  • fYear
    2008
  • fDate
    12-14 Oct. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    At present, technical standards play an important role in many markets, especially the hi-tech and information technology markets. Technical standards are not just a simple combination of technologies, which materialize the best practices of different technologies. Against industrial transformation and comparative advantage in China, the paper, based on the practical significance by developing the independent technology standards, puts forward the concept of independent technology standards, and further analyzes the complex relationship between technical standards and technological innovation.The results show that technological innovation can promote the development of technical standards and furthermore the whole industry; technical standards not only offer the platform to technological innovation,but also have some negative impacts on it. After the analysis, the coordinated development between them based on the active and flexible participation of different interest groups is suggested.
  • Keywords
    DP industry; innovation management; hi-tech market; independent technology standards; information technology markets; technological innovation; Commercialization; Information technology; Innovation management; Intellectual property; Macroeconomics; Standardization; Standards development; Standards organizations; Technological innovation; Technology management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Communications, Networking and Mobile Computing, 2008. WiCOM '08. 4th International Conference on
  • Conference_Location
    Dalian
  • Print_ISBN
    978-1-4244-2107-7
  • Electronic_ISBN
    978-1-4244-2108-4
  • Type

    conf

  • DOI
    10.1109/WiCom.2008.3057
  • Filename
    4681246