• DocumentCode
    481645
  • Title

    A Generalized Framework for System-Wide Energy Savings in Hard Real-Time Embedded Systems

  • Author

    Zeng, Gang ; Tomiyama, Hiroyuki ; Takada, Hiroaki ; Ishihara, Tohru

  • Author_Institution
    Grad. Sch. of Inf. Sci., Nagoya Univ. Furo-cho, Nagoya
  • Volume
    1
  • fYear
    2008
  • fDate
    17-20 Dec. 2008
  • Firstpage
    206
  • Lastpage
    213
  • Abstract
    A generalized dynamic energy performance scaling (DEPS) framework is proposed for exploring application-specific energy-saving potential in hard real-time embedded systems. This software-centric framework focuses on system-wide energy reduction and takes advantage of possible power control mechanisms to trade off performance for energy savings. Three existing technologies, i.e., dynamic hardware resource configuration (DHRC), dynamic voltage frequency scaling (DVFS), and dynamic power management (DPM) have been employed in this framework to achieve the maximal energy savings. Static and dynamic schemes of DEPS are proposed to deal with stable or variable workload in the embedded systems. Through a case study, its effectiveness has been validated.
  • Keywords
    embedded systems; power aware computing; application-specific energy saving; dynamic hardware resource configuration; dynamic power management; dynamic voltage frequency scaling; generalized dynamic energy performance scaling framework; power control mechanism; real-time embedded systems; software-centric framework; system-wide energy reduction; system-wide energy savings; Dynamic voltage scaling; Embedded system; Energy management; Frequency; Hardware; Power control; Power system management; Real time systems; Resource management; Technology management; dynamic hardware source configuration; dynamic power management; dynamic voltage frequency scaling; energy-aware scheduling; hard real-time embedded systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Embedded and Ubiquitous Computing, 2008. EUC '08. IEEE/IFIP International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-0-7695-3492-3
  • Type

    conf

  • DOI
    10.1109/EUC.2008.101
  • Filename
    4756340