• DocumentCode
    48183
  • Title

    Memory in the third dimension

  • Author

    Courtland, Rachel

  • Volume
    51
  • Issue
    1
  • fYear
    2014
  • fDate
    Jan-14
  • Firstpage
    60
  • Lastpage
    61
  • Abstract
    A 3-D revolution is slowly making its way across the chip industry. Intel set it off in 2011 when it debuted logic chips bearing transistors that pop out of the plane of the chip. This year, memory makers are joining the game with two innovations of their own.
  • Keywords
    Flash memory; Memory architecture; Memory management; Three dimensional displays;
  • fLanguage
    English
  • Journal_Title
    Spectrum, IEEE
  • Publisher
    ieee
  • ISSN
    0018-9235
  • Type

    jour

  • DOI
    10.1109/MSPEC.2014.6701436
  • Filename
    6701436
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=48183