DocumentCode :
48183
Title :
Memory in the third dimension
Author :
Courtland, Rachel
Volume :
51
Issue :
1
fYear :
2014
fDate :
Jan-14
Firstpage :
60
Lastpage :
61
Abstract :
A 3-D revolution is slowly making its way across the chip industry. Intel set it off in 2011 when it debuted logic chips bearing transistors that pop out of the plane of the chip. This year, memory makers are joining the game with two innovations of their own.
Keywords :
Flash memory; Memory architecture; Memory management; Three dimensional displays;
fLanguage :
English
Journal_Title :
Spectrum, IEEE
Publisher :
ieee
ISSN :
0018-9235
Type :
jour
DOI :
10.1109/MSPEC.2014.6701436
Filename :
6701436
Link To Document :
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