• DocumentCode
    481830
  • Title

    3D odometry based on body configuration information of passive linkages

  • Author

    Chugo, Daisuke ; Kawabata, Kuniaki ; Kaetsu, Hayato ; Asama, Hajime ; Mishima, Taketoshi ; Takase, Kunikatsu

  • Author_Institution
    Univ. of Electro-Commun., Chofu
  • fYear
    2008
  • fDate
    10-13 Nov. 2008
  • Firstpage
    1553
  • Lastpage
    1558
  • Abstract
    In our current research, we are developing a holonomic mobile system which is capable of running over the step. This system realizes omni-directional motion on flat floor using special wheels and passes over non-flat ground in forward or backward direction using the passive suspension mechanism. Odometry is popular position tracking scheme for a wheeled mobile robot, however, in the case of non-flat ground, it is difficult to estimate its position using odometry because an angular relationship between wheels and ground is unknown. Therefore, in this paper, we propose a new odometry method which extends 2D odometry to the 3D space. Our key idea is using the body configuration information which changes according to the shape of the terrain. Using our idea, our mobile platform can measure the shape of terrain without external sensors. We verify the performance of our proposed control scheme by the experiments using our prototype.
  • Keywords
    distance measurement; mobile robots; motion control; position control; shape measurement; suspensions (mechanical components); 3D odometry; angular relationship; backward direction; body configuration information; flat floor; forward direction; holonomic mobile system; mobile platform; nonflat ground; omnidirectional motion; passive linkages; passive suspension mechanism; position estimation; position tracking; terrain shape measurement; wheeled mobile robot; Chemicals; Costs; Couplings; Land vehicles; Mobile robots; Prototypes; Road vehicles; Shape measurement; Space vehicles; Wheels;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 2008. IECON 2008. 34th Annual Conference of IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    1553-572X
  • Print_ISBN
    978-1-4244-1767-4
  • Electronic_ISBN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2008.4758185
  • Filename
    4758185