High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications

Author

Decrossas, Emmanuel ; Glover, Michael D. ; Porter, Kaoru ; Cannon, Tom ; Stegeman, Thomas ; Allen-McCormack, Nicholas ; Hamilton, Michael C. ; Mantooth, H. Alan

Author_Institution

High Density Electron. Center, Univ. of Arkansas, Fayetteville, AR, USA

Volume

5

Issue

3

fYear

2015

fDate

Mar-15

Firstpage

307

Lastpage

313

Abstract

A new design of stripline transition structures and flip-chip interconnects for high-speed digital communication systems implemented in low-temperature cofired ceramic (LTCC) substrates is presented. Simplified fabrication, suitability for LTCC machining, suitability for integration with other components, and connection to integrated stripline or microstrip interconnects for LTCC multichip modules and system on package make this approach well suited for miniaturized, advanced broadband, and highly integrated multichip ceramic modules. The transition provides excellent signal integrity at high-speed digital data rates up to 28 Gbits/s. Full-wave simulations and experimental results demonstrate a cost-effective solution for a wide frequency range from dc to 30 GHz and beyond. Signal integrity and high-speed digital data rate performances are verified through eye diagram and time-domain reflectometry and time-domain transmissometry measurements over a 10-cm long stripline.

Keywords

ceramic packaging; integrated circuit interconnections; multichip modules; system-on-package; time-domain reflectometry; eye diagram; flip-chip interconnects; frequency 0 GHz to 30 GHz; high-data-rate quasicoaxial LTCC vertical interconnect transitions; high-performance quasicoaxial LTCC vertical interconnect transitions; high-speed digital data rate; low-temperature cofired ceramic substrates; multichip modules; signal integrity; size 10 cm; stripline transition structures; system-on-package applications; time-domain reflectometry; time-domain transmissometry; Bit error rate; Connectors; Fabrication; Frequency measurement; Stripline; Time-domain analysis; Transmission line measurements; Full tape thickness feature; low-temperature cofired ceramic (LTCC) interconnect; multichip module (MCM); quasi-coaxial vertical transition; signal integrity; system on package; system on package.;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2015.2394234

Filename

7029651