DocumentCode :
4829
Title :
Sensing Power MOSFET Junction Temperature Using Circuit Output Current Ringing Decay
Author :
He Niu ; Lorenz, Robert D.
Author_Institution :
Wisconsin Electr. Machines & Power Electron. Consortium, Univ. of Wisconsin-Madison, Madison, WI, USA
Volume :
51
Issue :
2
fYear :
2015
fDate :
March-April 2015
Firstpage :
1763
Lastpage :
1773
Abstract :
Junction temperature (Tj) sensing requirements for fast MOSFET junction temperature control and high-power fast switching power converter protection are not easily met with nonintrusive techniques. This paper presents a noninvasive circuit-model-based sensing method suitable for a high-bandwidth hard-switching converter power MOSFET junction temperature estimation without any additional temperature detector. For the purpose of demonstrating MOSFET junction temperature sensing, a chopper circuit is used. The ringing superimposed with a circuit load current is used for MOSFET junction temperature estimation. A “gate drive-RDS-on-L-C” resonant model is implemented, indicating the mechanism of power MOSFET turn-on dynamics. Modeling includes the gate-drive output parasitics, power MOSFET intrinsic parameters, PCB parasitics, and load parasitics. To evaluate the methodology, LTspice simulation and experimental results are studied.
Keywords :
choppers (circuits); power MOSFET; power convertors; LTspice simulation; PCB parasitics; chopper circuit; circuit load current; circuit output current ringing decay; fast junction temperature control; gate-drive output parasitics; high-bandwidth hard-switching converter; high-power fast switching power converter protection; load parasitics; nonintrusive techniques; noninvasive circuit-model-based sensing method; power MOSFET junction temperature sensing; power intrinsic parameters; turn-on dynamics; Integrated circuit modeling; Junctions; MOSFET; Semiconductor device modeling; Temperature measurement; Temperature sensors; Junction; power MOSFET; temperature measurement;
fLanguage :
English
Journal_Title :
Industry Applications, IEEE Transactions on
Publisher :
ieee
ISSN :
0093-9994
Type :
jour
DOI :
10.1109/TIA.2014.2344501
Filename :
6868282
Link To Document :
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