• DocumentCode
    483390
  • Title

    B3. electrical overstress (EOS) failure causes and failure analysis

  • Author

    Dangelmayer, Ted

  • Author_Institution
    Dangelmayer Associates, LLC, USA
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    343
  • Lastpage
    343
  • Abstract
    During this highly interactive workshop you will learn about the causes of EOS and what is known about its failure analysis. A panel of industry experts will help lead the discussion and attendees will be encouraged to actively participate. A number of common root causes will be discussed, failure analysis differentiation from ESD as well as a less well known source — ESD from Charged Board Model (CBM) stresses. How do you recognize ESD versus ESD failures? Is it true that ESD from CBM is often misdiagnosed as EOS? Who is responsible for addressing EOS failures — Design or Manufacturing? What are the design protection choices for EOS protection — IC; Circuit Board and System? These are some of the questions that will be addressed during this workshop.
  • Keywords
    Earth Observing System; Electrostatic discharge; Failure analysis; Instruments; Manufacturing; Printed circuits; Protection; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2008. EOS/ESD 2008. 30th
  • Conference_Location
    Tucson, AZ, USA
  • Print_ISBN
    978-1-58537-146-4
  • Electronic_ISBN
    978-1-58537-147-1
  • Type

    conf

  • Filename
    4772157