DocumentCode :
483390
Title :
B3. electrical overstress (EOS) failure causes and failure analysis
Author :
Dangelmayer, Ted
Author_Institution :
Dangelmayer Associates, LLC, USA
fYear :
2008
fDate :
7-11 Sept. 2008
Firstpage :
343
Lastpage :
343
Abstract :
During this highly interactive workshop you will learn about the causes of EOS and what is known about its failure analysis. A panel of industry experts will help lead the discussion and attendees will be encouraged to actively participate. A number of common root causes will be discussed, failure analysis differentiation from ESD as well as a less well known source — ESD from Charged Board Model (CBM) stresses. How do you recognize ESD versus ESD failures? Is it true that ESD from CBM is often misdiagnosed as EOS? Who is responsible for addressing EOS failures — Design or Manufacturing? What are the design protection choices for EOS protection — IC; Circuit Board and System? These are some of the questions that will be addressed during this workshop.
Keywords :
Earth Observing System; Electrostatic discharge; Failure analysis; Instruments; Manufacturing; Printed circuits; Protection; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2008. EOS/ESD 2008. 30th
Conference_Location :
Tucson, AZ, USA
Print_ISBN :
978-1-58537-146-4
Electronic_ISBN :
978-1-58537-147-1
Type :
conf
Filename :
4772157
Link To Document :
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