DocumentCode
483390
Title
B3. electrical overstress (EOS) failure causes and failure analysis
Author
Dangelmayer, Ted
Author_Institution
Dangelmayer Associates, LLC, USA
fYear
2008
fDate
7-11 Sept. 2008
Firstpage
343
Lastpage
343
Abstract
During this highly interactive workshop you will learn about the causes of EOS and what is known about its failure analysis. A panel of industry experts will help lead the discussion and attendees will be encouraged to actively participate. A number of common root causes will be discussed, failure analysis differentiation from ESD as well as a less well known source — ESD from Charged Board Model (CBM) stresses. How do you recognize ESD versus ESD failures? Is it true that ESD from CBM is often misdiagnosed as EOS? Who is responsible for addressing EOS failures — Design or Manufacturing? What are the design protection choices for EOS protection — IC; Circuit Board and System? These are some of the questions that will be addressed during this workshop.
Keywords
Earth Observing System; Electrostatic discharge; Failure analysis; Instruments; Manufacturing; Printed circuits; Protection; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium, 2008. EOS/ESD 2008. 30th
Conference_Location
Tucson, AZ, USA
Print_ISBN
978-1-58537-146-4
Electronic_ISBN
978-1-58537-147-1
Type
conf
Filename
4772157
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