• DocumentCode
    483394
  • Title

    C.3 The challenge of CDM testing

  • Author

    Ashton, Robert

  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    347
  • Lastpage
    347
  • Abstract
    CDM is recognized as the main ESD threat in today’s electronics manufacturing environment. Unfortunately CDM is increasingly seen as immature. There are competing standards: JEDEC and ESDA versions of Field Induced CDM (F-CDM), JEITA’s direct charging CDM and even use of the Socketed Device Model, each producing different failure thresholds. F-CDM, the most widely accepted, has numerous technical challenges. Air discharge in F-CDM has inherent variability, F-CDM is a challenge for small and odd shaped devices, the pulse size does not scale with C for large packages and waveforms that look excellent at 1GHz have higher frequency components that can affect test results. Meanwhile designers face limits on the current that can be carried during a CDM event. This workshop will allow panelists and attendees to express concerns and describe a path to a better CDM test environment.
  • Keywords
    Earth Observing System; Electronic equipment testing; Electrostatic discharge; Frequency; Packaging; Pulse shaping methods; Semiconductor device manufacture; Semiconductor device testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2008. EOS/ESD 2008. 30th
  • Conference_Location
    Tucson, AZ, USA
  • Print_ISBN
    978-1-58537-146-4
  • Electronic_ISBN
    978-1-58537-147-1
  • Type

    conf

  • Filename
    4772161