DocumentCode :
483744
Title :
Dual-side cooled novel IPM and improved capability of inverter for elevated-temperature operations
Author :
Jie Chang ; Changming Liao
Author_Institution :
Florida State Univ., Tallahassee, FL
Volume :
1
fYear :
2006
fDate :
14-16 Aug. 2006
Abstract :
Novel two-side cooling for integrated power modules (IPM) is developed for elevated-temperature operations. This approach applies and improves commercially off-the-shelf (COTS) products of IPM without significantly changing the original packaging design and manufacture´s fabrication process. It can reduce the p-n junction temperature rise of the power devices inside by 20% at an equivalent load, thus increasing operating ambient temperatures, which is desirable for integrated motors and elevated-temperature applications. The size and volume associated with conventional cooling mechanism can be shrunk. DC-link capacitor reduction with adaptive PWM control is also discussed
Keywords :
PWM invertors; adaptive control; cooling; power semiconductor devices; thermal management (packaging); COTS; DC-link capacitor reduction; IPM; adaptive PWM control; commercially off-the-shelf products; conventional cooling mechanism; dual-side cooled integrated power modules; elevated-temperature operation; integrated AC motors; inverter; manufacture fabrication process; p-n junction temperature rise; packaging design; power devices; Capacitors; Cooling; Fabrication; Manufacturing processes; Multichip modules; P-n junctions; Packaging; Pulse width modulation; Pulse width modulation inverters; Temperature; elevated-temperature operations; integrated AC motors and drives; integrated power modules; two-side cooling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Motion Control Conference, 2006. IPEMC 2006. CES/IEEE 5th International
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0448-7
Type :
conf
DOI :
10.1109/IPEMC.2006.4777956
Filename :
4777956
Link To Document :
بازگشت