DocumentCode :
483820
Title :
An Analytical Model for 4H-SiC Super-Junction Devices
Author :
Yu, L.C. ; Sheng, K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ
Volume :
2
fYear :
2006
fDate :
14-16 Aug. 2006
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, for the first time, a new and easy-to-implement analytical model is developed for the breakdown voltage and specific on-resistance of 4H-SiC super-junction devices. The model features simple analytical equations while is still capable of predicting the device characteristics accurately for a large variety of device structural parameters. Accuracy of this model is verified by multi-dimensional numerical simulation
Keywords :
electric resistance; power semiconductor devices; semiconductor device breakdown; semiconductor device models; semiconductor junctions; silicon compounds; wide band gap semiconductors; 4H-SiC super-junction devices; SiC; analytical model; breakdown voltage; device characteristics; device structural parameters; multidimensional numerical simulation; power device; specific on-resistance; Analytical models; Doping; Numerical simulation; Poisson equations; Power semiconductor devices; Predictive models; Semiconductor materials; Shape; Structural engineering; Voltage; 4H-SiC; Model; Power device; Super-junction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Motion Control Conference, 2006. IPEMC 2006. CES/IEEE 5th International
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0448-7
Type :
conf
DOI :
10.1109/IPEMC.2006.4778178
Filename :
4778178
Link To Document :
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