Title :
Fabrication of Multi-Scale Triangular Patch High Impedance Ground Planes to Improve the Bandwidth of Conformal Bow-Tie Antennas for Remote Sensing
Author :
Cakiroglu, Bora ; Collins, Peter J. ; Havrilla, Michael J. ; Sertel, Kubilay ; Terzuoli, Andrew J.
Author_Institution :
Air Force Inst. of Technol., Dayton, OH
Abstract :
The realization and performance is demonstrated of a conformal bow-tie antenna printed on a multi-scale triangular element mushroom structure high-impedance ground-plane (HIGP). The two-scale HIGP was designed to exhibit a large frequency band-gap to cover the relatively broad operational frequency bandwidth of the bow-tie antenna. HIGP elements were chosen to be triangular to form a natural commensurate blending of the bow-tie into the structure. The experimental performance is characterized of the bow-tie-HIGP combination from 2-10 GHz, and it is demonstrated that the negative effects of a perfect electric conductor ground-plane may be mitigated by using a HIGP.
Keywords :
antenna earths; antenna theory; geophysical equipment; remote sensing; antenna operational frequency bandwidth; conformal bow tie antenna bandwidth; frequency 2 GHz to 10 GHz; frequency band gap; high impedance ground planes; multiscale triangular element mushroom structure; multiscale triangular patch HIGP; perfect conductor effects; remote sensing antennas; Antenna measurements; Bandwidth; Broadband antennas; Dipole antennas; Fabrication; Frequency; Impedance; Photonic band gap; Remote sensing; Resonance; Antennas; High Impedance Ground Planes;
Conference_Titel :
Geoscience and Remote Sensing Symposium, 2008. IGARSS 2008. IEEE International
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-2807-6
Electronic_ISBN :
978-1-4244-2808-3
DOI :
10.1109/IGARSS.2008.4779996
