• DocumentCode
    48684
  • Title

    60-GHz Substrate Materials Characterization Using the Covered Transmission-Line Method

  • Author

    Papio Toda, Anna ; De Flaviis, Franco

  • Author_Institution
    Dept. of Electr. Eng., Univ. of California at Irvine, Irvine, CA, USA
  • Volume
    63
  • Issue
    3
  • fYear
    2015
  • fDate
    Mar-15
  • Firstpage
    1063
  • Lastpage
    1075
  • Abstract
    At millimeter-wave (mm-wave) frequencies, antennas and systems are highly influenced by the electromagnetic characteristics of packaging materials. Accurate knowledge of the complex permittivity of packaging materials is vital for the optimal and robust design of such systems. In this paper, the covered transmission-line method is used to determine the complex permittivity at 60 GHz for several common FR-4 and FR-5 packaging materials. Measurements show that packaging materials must be accurately characterized at high frequencies because their properties can appreciably differ from those at lower frequencies. Moreover, depending on the fabrication process, different thickness samples of the same material can have different permittivity values. The complex permittivity variation versus temperature is also analyzed. We show that, at low frequencies, this variation is negligible, but at mm-wave frequencies, it can represent up to a 5% variation in the relative permittivity and have a severe impact on the loss tangent. The covered transmission-line method is explained in detail and its accuracy and measurable permittivity range are also discussed.
  • Keywords
    CMOS integrated circuits; dielectric losses; integrated circuit packaging; materials testing; millimetre wave integrated circuits; permittivity measurement; substrates; transmission line matrix methods; FR-4 packaging materials; FR-5 packaging materials; antennas; covered transmission-line method; electromagnetic characteristics; fabrication process; frequency 60 GHz; loss tangent; millimeter-wave frequencies; mm-wave frequencies; relative permittivity; substrate materials characterization; Microstrip; Permittivity; Permittivity measurement; Substrates; Transmission line measurements; 60-GHz dielectric constant; Covered transmission-line method; millimeter-wave (mm-wave); packaging materials; permittivity; substrate materials;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2015.2394740
  • Filename
    7029708