Title :
Study on Transmission Characteristics of Carbon Nanotube Through Silicon Via Interconnect
Author :
Libo Qian ; Zhangming Zhu ; Yinshui Xia
Author_Institution :
Sch. of Inf. Sci. & Eng., Ningbo Univ., Ningbo, China
Abstract :
In this letter, the Resistance Inductance Capacitance Conductance (RLCG) parameters of carbon nanotube through silicon via (CNT-TSV) are modeled and a transmission line (TL) model is established through ABCD matrix. The impact of their geometrical and material parameters on the TSV transmission characteristics is analyzed over a wideband of frequency using the proposed model. An optimization methodology using air gap insulator is proposed to improve the transmission performance. SPICE results show that a 30.83% reduction in insertion loss and a 40.72% increase in eye open area, respectively.
Keywords :
carbon nanotubes; circuit optimisation; integrated circuit interconnections; integrated circuit modelling; matrix algebra; three-dimensional integrated circuits; transmission lines; ABCD matrix; CNT-TSV; RLCG parameters; SPICE; TL model; TSV transmission characteristics; air gap insulator; carbon nanotube through silicon via interconnect; eye open area; geometrical parameters; insertion loss reduction; material parameters; optimization methodology; resistance inductance capacitance conductance parameters; transmission line model; Air gaps; Carbon nanotubes; Inductance; Insertion loss; Integrated circuit interconnections; Resistance; Silicon; Through-silicon vias; Air gap; CNT-TSV; signal loss; transmission characteristics;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2014.2361429
