DocumentCode
49123
Title
The Axial Tensile Stress–Strain Characterization of Ag -Sheathed Bi 2212 Round Wire
Author
Chao Dai ; Bo Liu ; Jinggang Qin ; Fang Liu ; Yu Wu ; Chao Zhou
Author_Institution
Inst. of Plasma Phys., Hefei, China
Volume
25
Issue
3
fYear
2015
fDate
Jun-15
Firstpage
1
Lastpage
4
Abstract
The stress distribution generated by the differences in the thermal expansion and the electromagnetic load is the driving factor for the transport properties of Bi2212 superconducting round wire (RW). The effort on studying the impact of strain on the transport properties is increasing, in terms of the axial and transverse stiffness of the RW. Consequently, the experimental stress-strain data are required at the RW level for accurate modeling, analysis and eventually for optimizing cable design and manufacture. In this paper, the axial tensile measurements on Bi2212 RWs and component materials (Ag and Ag/Mg alloy) have been performed at room temperature, 77 K and 4.2 K, respectively. Comparing with LTS strand (e.g., Nb3Sn and NbTi) , the stiffness of Bi2212 RW is less, which has become the primary problem in its application. A simple model was used to simulate the stress-strain characteristic, and compared to experimental results.
Keywords
bismuth compounds; calcium compounds; high-temperature superconductors; magnesium alloys; silver alloys; stress-strain relations; strontium compounds; tensile strength; thermal expansion; Ag-sheathed Bi2212 round wire; Bi2212 superconducting round wire; LTS strand; axial tensile stress-strain characterization; axial transverse stiffness; cable design; driving factor; electromagnetic loading; stress distribution; temperature 293 K to 298 K; temperature 4.2 K; temperature 77 K; thermal expansion; transport properties; Niobium-tin; Strain; Superconducting cables; Superconducting filaments and wires; Temperature; Wires; Ag; Ag/Mg alloy; Bi2212; axial tensile performance; model;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2014.2368053
Filename
6963304
Link To Document