DocumentCode
492671
Title
DFM optimization of standard cells considering random and systematic defect
Author
Jang, Daehyun ; Ha, Naya ; Park, Joo-Hyun ; Paek, Seung-Weon ; Won, Hyo-Sig ; Choi, Kyu-Myung
Author_Institution
Samsung Electron. Co., Ltd., Yongin
Volume
01
fYear
2008
fDate
24-25 Nov. 2008
Abstract
In this study, we implemented an auto-correction method for layout of 45 nm standard cells to get design-for-manufacturability (DFM) friendly design. The proposed method avoids lithography hotspot and particle defect, which are the source of systematic and random variation, by utilizing litho simulation and critical area analysis during optimization. In addition, to achieve maximum benefit of standard cell optimization, most of the recommended rules (RR) are applied to the standard cells. To assure the consistency of the optimization result, priority was given for each rule and the optimization is performed based on the priority. Using the proposed method, optimization time decreased tremendously compared to manual correction; therefore, the proposed layout optimization can handle thousands of standard cells with reasonable runtime. Verification results with manufacturing checking deck showed that DFM-friendly index improved by over 4.3% on optimized cells when compared to the original cells.
Keywords
cellular arrays; design for manufacture; integrated circuit layout; optimisation; DFM optimization; autocorrection method; design-for-manufacturability; layout optimization; random variation; standard cells; systematic defect; Analytical models; Circuits; Computer aided analysis; Design for manufacture; Design optimization; Lithography; Manufacturing; Optical design; Optimization methods; Runtime; CAA; DFM; LFD; MCD; auto correction; contact doubling; layout optimization; litho hotspot; recommended rule; standard cell;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference, 2008. ISOCC '08. International
Conference_Location
Busan
Print_ISBN
978-1-4244-2598-3
Electronic_ISBN
978-1-4244-2599-0
Type
conf
DOI
10.1109/SOCDC.2008.4815575
Filename
4815575
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