DocumentCode
492710
Title
Fluidic manipulation and self-assembly of microdevices in railed microfluidic channels
Author
Chung, Su Eun ; Lee, Seung Ah ; Kim, Jiyun ; Kwon, Sunghoon
Author_Institution
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul
Volume
01
fYear
2008
fDate
24-25 Nov. 2008
Abstract
We demonstrate fluidic manipulation and assembly of silicon microchips by creatively combining railed microfluidics and computer-vision aided dynamic chip packaging. Externally fabricated silicon microchips are fluidically guided and self-assembled, potentially enabling low cost fluidic packaging of integrated circuits.
Keywords
electronic engineering computing; fluidic devices; integrated circuit packaging; microfluidics; monolithic integrated circuits; self-assembly; computer-vision aided dynamic chip packaging; fluidic manipulation; fluidic packaging; integrated circuits; microchips; microdevice self-assembly; railed microfluidic channels; Assembly; Cleaning; Etching; Microfluidics; Packaging; Polymers; Rails; Resists; Self-assembly; Silicon on insulator technology; Optofluidic maskless lithography; Railed microfluidics;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference, 2008. ISOCC '08. International
Conference_Location
Busan
Print_ISBN
978-1-4244-2598-3
Electronic_ISBN
978-1-4244-2599-0
Type
conf
DOI
10.1109/SOCDC.2008.4815636
Filename
4815636
Link To Document