• DocumentCode
    493286
  • Title

    Effects of gap error on the capacitive micro accelerometer

  • Author

    Zhou, Wu ; He, Xiao-Ping ; Su, Wei ; Li, Bai-Lin ; Chen, Li-Li

  • Author_Institution
    Sch. of Mech. Eng., SWJTU, Chengdu
  • fYear
    2009
  • fDate
    1-3 April 2009
  • Firstpage
    307
  • Lastpage
    312
  • Abstract
    Dimension uncertainty inevitably occurs in almost every fabrication of micro structure because of its small size and ununiformity of material, therefore, the dimension error is a significant factor to be considered in MEMS structure design. The unsymmetrical gaps of capacitors induced by processing are selected to analyze the effects of error on the performance of accelerometer including its sensitivity and pull-in voltage. The asymmetry of gaps concerns three type errors, firstly, one gap is smaller than another which equals to the design value, secondly, one gap is bigger than another which equals to the design value, and thirdly, two gaps are not equal, but both have errors. Analytical method is used to construct the force balance equation as the mass located in different position under different types of errors, and corresponding graphs are given to study the relation between parameters interested and structure error directly and vividly. The sensitivity of ideal structure is little larger than that with error, and the pull-in voltages under two conditions varies with the shift of structure parameter, the ratio is opt to 1 when the process error is small, but decreases rapidly with the increase of error.
  • Keywords
    accelerometers; capacitive sensors; capacitors; micromechanical devices; MEMS structure design; capacitive microaccelerometer; capacitors; dimension uncertainty; force balance equation; gap error effects; structure error; structure parameter; unsymmetrical gaps; Accelerometers; Capacitors; Differential equations; Error analysis; Fabrication; Micromechanical devices; Optimized production technology; Performance analysis; Uncertainty; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-3874-7
  • Type

    conf

  • Filename
    4919490