Title :
MEMS packaging process by film transfer using anti-sticking layer
Author :
Brault, S. ; Garel, O. ; Parrain, F. ; Desgeorges, M. ; Dufour-Gergam, E.
Author_Institution :
Inst. d´´Electron. Fondamentale, Univ. Paris Sud, Orsay
Abstract :
This paper presents a process study dedicated to packaging using film transfer technology. The key points of this process are the nickel micromoulding step for the formation of the protective caps, the bonding and separation steps from the protective caps to carrier wafer. For this process, lines of photosensitive BCB are used as intermediate adhesive material between the host wafer (supporting the MEMS) and the microcaps. The release step of the caps with the carrier wafer is realized by an anti-sticking layer.
Keywords :
adhesives; copper; electronics packaging; metallic thin films; micromechanical devices; moulding; titanium; MEMS packaging process; Teflon; Ti-Cu; adhesive material; antisticking layer; bonding step; carrier wafer; film transfer technology; host wafer; microcaps; nickel micromoulding step; protective caps; separation step; Dielectric substrates; Encapsulation; Etching; Micromechanical devices; Packaging; Protection; Silicon; Transistors; Wafer bonding; Wafer scale integration;
Conference_Titel :
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3874-7
