MEMS packaging process by film transfer using anti-sticking layer

Author

Brault, S. ; Garel, O. ; Parrain, F. ; Desgeorges, M. ; Dufour-Gergam, E.

Author_Institution

Inst. d´´Electron. Fondamentale, Univ. Paris Sud, Orsay

fYear

2009

fDate

1-3 April 2009

Firstpage

161

Lastpage

166

Abstract

This paper presents a process study dedicated to packaging using film transfer technology. The key points of this process are the nickel micromoulding step for the formation of the protective caps, the bonding and separation steps from the protective caps to carrier wafer. For this process, lines of photosensitive BCB are used as intermediate adhesive material between the host wafer (supporting the MEMS) and the microcaps. The release step of the caps with the carrier wafer is realized by an anti-sticking layer.

Keywords

adhesives; copper; electronics packaging; metallic thin films; micromechanical devices; moulding; titanium; MEMS packaging process; Teflon; Ti-Cu; adhesive material; antisticking layer; bonding step; carrier wafer; film transfer technology; host wafer; microcaps; nickel micromoulding step; protective caps; separation step; Dielectric substrates; Encapsulation; Etching; Micromechanical devices; Packaging; Protection; Silicon; Transistors; Wafer bonding; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on

Conference_Location

Rome

Print_ISBN

978-1-4244-3874-7

Type

conf

Filename

4919503