• DocumentCode
    493302
  • Title

    Reliability aspects of mechanical interlocking bond interfaces with nanostructured silicon grass

  • Author

    Stubenrauch, Mike ; Schwandt, Morris ; Hecht, Siegmar ; Hoffmann, Martin

  • Author_Institution
    Inst. of Micro- & Nanotechnol., Ilmenau Univ. of Technol., Ilmenau
  • fYear
    2009
  • fDate
    1-3 April 2009
  • Firstpage
    167
  • Lastpage
    169
  • Abstract
    dasiaBlack Siliconpsila can be used as mechanical bond interface alike a Velcroreg strapworking at any temperature without additional adhesives. An experimental setup and a method for a pulsating load is shown. Experiments have proven cycle numbers of 1 million and more at 80% of the static strength. This indicates that there is no fatigue, creeping or defect propagation effect.
  • Keywords
    adhesion; adhesives; elemental semiconductors; interface phenomena; nanostructured materials; silicon; surface structure; Si; Velcro strap; adhesives; black silicon; mechanical bond interface; mechanical interlocking bond interfaces; nanostructured silicon grass; pulsating load; Bonding forces; Dry etching; Fatigue; Needles; Silicon; Stability; Surface fitting; Temperature; Test equipment; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-3874-7
  • Type

    conf

  • Filename
    4919506
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=493302