Title :
Reliability aspects of mechanical interlocking bond interfaces with nanostructured silicon grass
Author :
Stubenrauch, Mike ; Schwandt, Morris ; Hecht, Siegmar ; Hoffmann, Martin
Author_Institution :
Inst. of Micro- & Nanotechnol., Ilmenau Univ. of Technol., Ilmenau
Abstract :
dasiaBlack Siliconpsila can be used as mechanical bond interface alike a Velcroreg strapworking at any temperature without additional adhesives. An experimental setup and a method for a pulsating load is shown. Experiments have proven cycle numbers of 1 million and more at 80% of the static strength. This indicates that there is no fatigue, creeping or defect propagation effect.
Keywords :
adhesion; adhesives; elemental semiconductors; interface phenomena; nanostructured materials; silicon; surface structure; Si; Velcro strap; adhesives; black silicon; mechanical bond interface; mechanical interlocking bond interfaces; nanostructured silicon grass; pulsating load; Bonding forces; Dry etching; Fatigue; Needles; Silicon; Stability; Surface fitting; Temperature; Test equipment; Testing;
Conference_Titel :
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3874-7
