DocumentCode
493303
Title
Identification of mechanical defects in MEMS using dynamic measurements for application in the production monitoring
Author
Gerbach, R. ; Ebert, M. ; Brokmann, G. ; Hein, T. ; Bagdahn, J.
Author_Institution
Fraunhofer Inst. for Mech. of Mater., Halle
fYear
2009
fDate
1-3 April 2009
Firstpage
384
Lastpage
389
Abstract
In this paper investigations for the non-destructive characterization of MEMS (Micro-Electro-Mechanical- Systems) are presented that can be applied in the production monitoring in early stages. Different aspects and experimental results are shown for silicon membrane structures with artificial faults. The structures were characterized by their resonant frequencies and associated mode shapes measured via laser-Doppler vibrometry. The consequence of the artificial faults is investigated on the basis of the ratios of measured resonant frequencies and the quantified comparison of mode shapes using the MAC-value. The artificial faults have a significant influence on the dynamic properties which depends on their size. According to the results a systematical approach for the dynamic characterization is derived from the results of the investigations for a possible application in the production monitoring.
Keywords
Doppler measurement; electrical faults; elemental semiconductors; laser velocimetry; membranes; micromechanical devices; nondestructive testing; silicon; Si; artificial faults; laser-Doppler vibrometry; mechanical defects; microelectro-mechanical systems; production monitoring; resonant frequency; silicon membrane structures; Biomembranes; Frequency measurement; Laser modes; Mechanical variables measurement; Micromechanical devices; Monitoring; Production systems; Resonant frequency; Shape measurement; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location
Rome
Print_ISBN
978-1-4244-3874-7
Type
conf
Filename
4919507
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