RF MEMS front-end resonator, filters, varactors and a switch using a CMOS-MEMS process

The paper describes the design of multiple RF MEMS front-end components that could replace off-chip units in future transceivers. The components can effectively be combined and co-fabricated with CMOS circuitry. A CMOS-MEMS approach is used, which means that the microelectromechanical parts are made by multi-layer structures in a standard CMOS process. The ASIMPS procedure offered by CMP uses the CMOS processing at STMicroelectronics, and a simple post-CMOS release-etching step is performed at Carnegie Mellon University, USA. The paper presents a resonator, resonating filters, electrothermally operated varactors and an experimental switch. The components are modeled and simulated by using CoverntorWare FEM software. A test chip is currently in production.