DocumentCode
493318
Title
Thermal management integration for microfluidics applications
Author
Camps, T. ; Marty, B. ; Tasselli, J. ; Marty, A. ; Lagrange, D.
Author_Institution
LAAS, CNRS, Toulouse
fYear
2009
fDate
1-3 April 2009
Firstpage
107
Lastpage
112
Abstract
This paper reports on the design and fabrication of integrated thermal sensors or thermal sources for various MEMS applications and particularly microfluidics applications. The capabilities of polysilicon diodes as thermal sensors are demonstrated with good thermal sensitivities (55 mV/degC). An instrumentation platform has also been developed to measure the temperature variations through microchannels.
Keywords
microfluidics; semiconductor diodes; temperature measurement; temperature sensors; thermal management (packaging); MEMS applications; integrated thermal sensors; microchannels; microfluidics; polysilicon diodes; temperature variation measurement; thermal management integration; thermal sensitivities; thermal sources; Diodes; Fabrication; Instruments; Microchannel; Microfluidics; Micromechanical devices; Temperature measurement; Temperature sensors; Thermal management; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location
Rome
Print_ISBN
978-1-4244-3874-7
Type
conf
Filename
4919522
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