DocumentCode
493329
Title
Properties of M-AFM probe affected by nanostructural metal coatings
Author
Hosoi, A. ; Hamada, M. ; Fujimoto, A. ; Ju, Y.
Author_Institution
Dept. of Mech. Sci. & Eng., Nagoya Univ., Nagoya
fYear
2009
fDate
1-3 April 2009
Firstpage
197
Lastpage
201
Abstract
In order to develop a new structure microwave probe, the fabrication of the atomic force microscope (AFM) probe on a GaAs wafer was studied and characteristics of the AFM probe with different nanostructural metal coating were evaluated in order to understand the performance of the probe for the topography of materials and the propagation of microwave signals. The fabricated probe had a tip of 8 mum high and curvature radius approximately 30 nm. The dimensions of the cantilever are 250 times 30 times 15 mum. A waveguide was introduced by the sputtering and the electron beam (EB) evaporation technique on the top and bottom surfaces of the GaAs AFM probe with Au or Al film. The open structure of the waveguide at the tip of the probe was introduced by using focused ion beam (FIB) fabrication. AFM topography of a grating sample was measured by using each fabricated probe. It was found that the fabricated probes coated with the Au or Al film have nanometer order resolution. Moreover, using the Au-coating probe formed by the EB evaporation technique, microwave emission was detected successfully at the tip of the probe by approaching an Au film sample.
Keywords
atomic force microscopy; cantilevers; coatings; electron probes; evaporation; focused ion beam technology; microwave devices; sputtering; surface topography; waveguides; AFM topography; GaAs; atomic force microscope probe; cantilever; electron beam evaporation; focused ion beam fabrication; microwave probe; microwave signal propagation; nanostructural metal coatings; sputtering; Atomic force microscopy; Coatings; Fabrication; Gallium arsenide; Gold; Inorganic materials; Microwave propagation; Nanostructured materials; Probes; Surfaces;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location
Rome
Print_ISBN
978-1-4244-3874-7
Type
conf
Filename
4919534
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