Investigation of key technologies for System-in-Package integration of inertial MEMS

Author

Marenco, N. ; Reinert, W. ; Warnat, S. ; Lange, P. ; Gruenzig, S. ; Allegato, G. ; Hillmann, G. ; Kostner, H. ; Gal, W. ; Guadagnuolo, S. ; Conte, A. ; Malecki, K. ; Friedel, K.

Author_Institution

Fraunhofer Inst. for Silicon Technol., Itzehoe

fYear

2009

fDate

1-3 April 2009

Firstpage

35

Lastpage

40

Abstract

ldquoSystem-in-Packagerdquo is a key concept to achieve minimum size and costs in hybrid integration. We investigated several related technologies for inertial sensor MEMS packaging, with special emphasis on vacuum packaging of resonant devices like gyroscopes: Hermetic Chip-to-Wafer and Wafer-to-Wafer bonding, Through-Silicon Via in thick and in thin wafers, thin-film getter deposition and fine patterning, and full-wafer transfer molding. This paper shows the achievements of the project after finalizing the main R&D activities. Currently, we are attempting the full flow implementation on functional devices.

Keywords

microsensors; moulding; system-in-package; fine patterning; full-wafer transfer molding; functional devices; gyroscopes:; hermetic chip-to-wafer bonding; inertial sensor MEMS packaging; resonant devices; system-in-package integration; vacuum packaging; wafer-to-wafer bonding; Costs; Gyroscopes; Micromechanical devices; Packaging; Resonance; Sputtering; Thin film devices; Thin film sensors; Vacuum technology; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on

Conference_Location

Rome

Print_ISBN

978-1-4244-3874-7

Type

conf

Filename

4919535