Investigation of key technologies for System-in-Package integration of inertial MEMS

ldquoSystem-in-Packagerdquo is a key concept to achieve minimum size and costs in hybrid integration. We investigated several related technologies for inertial sensor MEMS packaging, with special emphasis on vacuum packaging of resonant devices like gyroscopes: Hermetic Chip-to-Wafer and Wafer-to-Wafer bonding, Through-Silicon Via in thick and in thin wafers, thin-film getter deposition and fine patterning, and full-wafer transfer molding. This paper shows the achievements of the project after finalizing the main R&D activities. Currently, we are attempting the full flow implementation on functional devices.