DocumentCode
493334
Title
Design optimization and stamper fabrication of light guiding plates using silicon based micro-features
Author
YU, Jyh-Cheng ; Hsu, Pei-Kai
Author_Institution
Nat. Kaohsiung First Univ. of Sci. & Technol., Nanzih
fYear
2009
fDate
1-3 April 2009
Firstpage
202
Lastpage
207
Abstract
This study applies a novel fabrication process of molding stamper that combines anisotropic wet etching of silicon-on-insulator (SOI) wafers with electroforming to produce precision stampers. Micron-size features, such as trapezoidal grooves and prisms, can be accurately fabricated and distributed. Because the feature geometry and the distribution can be accurately realized using the proposed scheme, the design optimization of light guide plate (LGP) become realistic. By observing the illumination characteristics of LED edge-lit LGP, the distribution pattern of the LGP is transformed into the parameter design of 7 anchor spacing and the spacing modulation amplitude. This study manipulates the distribution parameters using the fuzzy optimization to obtain a LGP design with high illumination uniformity. The design of a LGP of 3.5 inch using LED light source is used as an illustrated example. The optical software, TracePro is applied to simulate the luminance performance. The optimization converges quickly and provides the optimum design with an average brightness of 2266 (nit) and uniformity of 90% without any use of diffusive sheets. The application demonstrates the feasibility and effectiveness of the proposed scheme.
Keywords
electroforming; etching; light emitting diodes; micromechanical devices; moulding; optimisation; silicon-on-insulator; LED edge-lit LGP; LED light source; TracePro; anisotropic wet etching; brightness; design optimization; diffusive sheets; electroforming; fuzzy optimization; light emitting diodes; light guiding plates; luminance performance; molding stamper; optical software; prisms; silicon based microfeatures; silicon-on-insulator wafers; size 3.5 inch; spacing modulation amplitude; stamper fabrication; trapezoidal grooves; Amplitude modulation; Anisotropic magnetoresistance; Design optimization; Fabrication; Geometry; Light emitting diodes; Light sources; Lighting; Silicon on insulator technology; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location
Rome
Print_ISBN
978-1-4244-3874-7
Type
conf
Filename
4919539
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