Title :
Design issues of BAW employment in 3D integrated sensor nodes
Author :
Prainsack, J. ; Dielacher, M. ; Flatscher, M. ; Herndl, T. ; Matischek, R. ; Stolle, J. ; Weber, W.
Author_Institution :
Infineon Technol., Graz
Abstract :
An advanced sensor node for direct tire pressure monitoring is presented, where the shock-sensitive crystal is replaced by a bulk acoustic wave (BAW) based resonator. Since the applied components are arranged in a 3D integrated stack, a wide range of new design issues arise. This paper investigates system issues due to temperature gradients in a 3D stack as well as the radio frequency (RF) characteristics of through silicon vias (TSV) in particular focusing on their electrical efficiency.
Keywords :
bulk acoustic wave devices; pressure sensors; tyres; 3D integrated sensor nodes; bulk acoustic wave based resonator; direct tire pressure monitoring; electrical efficiency; temperature gradients; through silicon vias; Acceleration; Acoustic sensors; Acoustic waves; Employment; Monitoring; Radio frequency; Robustness; Silicon; Temperature sensors; Tires;
Conference_Titel :
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3874-7
