• DocumentCode
    493343
  • Title

    Analysis of material processing of sol-gel derived PZT to the performance of microaccelerometer applications

  • Author

    Yu, Jyh-Cheng ; Wu, Jun-Xiang

  • Author_Institution
    Nat. Kaohsiung First Univ. of Sci. & Technol., Kaohsiung
  • fYear
    2009
  • fDate
    1-3 April 2009
  • Firstpage
    208
  • Lastpage
    211
  • Abstract
    The processing conditions of the sol-gel derived lead zirconate titanate (PZT) thin films have significant influences on the piezoelectric characteristics and the interface quality, and affect the device performance of the following applications. High temperature annealing of sol-gel derived PZT is required to crystallize the spin-on precursors, but often cause cracking and diffusion of structure layers. The introduction of LSMO oxide electrode in this study not only improve the crystallization and fatigue resistance of PZT film, but also prevent possible cracking due to excessive thermal stress. Two types of annealing including furnace and rapid thermal annealing are investigated and the following poling conditions are presented. To assess the overall performance of the PZT films from various processing conditions, a single-axial piezoelectric accelerometer is fabricated. The initial result shows the feasibility of the experimental concept. Future experiments are pending to derive the optimum processing conditions for the accelerometer application.
  • Keywords
    annealing; crystallisation; fatigue; sol-gel processing; thermal stresses; thin films; LSMO oxide electrode; PZT thin films; crystallization resistance; device performance; fatigue resistance; furnaces; high temperature annealing; interface quality; lead zirconate titanate; material processing; microaccelerometer application; piezoelectric characteristics; poling condition; rapid thermal annealing; single-axial piezoelectric accelerometer; sol-gel derived PZT; spin-on precursor; thermal stress; Accelerometers; Crystallization; Materials processing; Performance analysis; Piezoelectric films; Rapid thermal annealing; Rapid thermal processing; Thermal resistance; Thermal stresses; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-3874-7
  • Type

    conf

  • Filename
    4919548