DocumentCode :
493343
Title :
Analysis of material processing of sol-gel derived PZT to the performance of microaccelerometer applications
Author :
Yu, Jyh-Cheng ; Wu, Jun-Xiang
Author_Institution :
Nat. Kaohsiung First Univ. of Sci. & Technol., Kaohsiung
fYear :
2009
fDate :
1-3 April 2009
Firstpage :
208
Lastpage :
211
Abstract :
The processing conditions of the sol-gel derived lead zirconate titanate (PZT) thin films have significant influences on the piezoelectric characteristics and the interface quality, and affect the device performance of the following applications. High temperature annealing of sol-gel derived PZT is required to crystallize the spin-on precursors, but often cause cracking and diffusion of structure layers. The introduction of LSMO oxide electrode in this study not only improve the crystallization and fatigue resistance of PZT film, but also prevent possible cracking due to excessive thermal stress. Two types of annealing including furnace and rapid thermal annealing are investigated and the following poling conditions are presented. To assess the overall performance of the PZT films from various processing conditions, a single-axial piezoelectric accelerometer is fabricated. The initial result shows the feasibility of the experimental concept. Future experiments are pending to derive the optimum processing conditions for the accelerometer application.
Keywords :
annealing; crystallisation; fatigue; sol-gel processing; thermal stresses; thin films; LSMO oxide electrode; PZT thin films; crystallization resistance; device performance; fatigue resistance; furnaces; high temperature annealing; interface quality; lead zirconate titanate; material processing; microaccelerometer application; piezoelectric characteristics; poling condition; rapid thermal annealing; single-axial piezoelectric accelerometer; sol-gel derived PZT; spin-on precursor; thermal stress; Accelerometers; Crystallization; Materials processing; Performance analysis; Piezoelectric films; Rapid thermal annealing; Rapid thermal processing; Thermal resistance; Thermal stresses; Titanium compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3874-7
Type :
conf
Filename :
4919548
Link To Document :
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