3D integration technologies

3D integration is a key solution to the predicted performance problems of future ICs as well as it offers extreme miniaturization and cost-effective fabrication of More than Moore products (e.g. e-CUBES^reg). Through silicon via (TSV) technologies enable high interconnect performance at relatively high fabrication cost compared to 3D packaging. A post backend-of-line TSV process is introduced as optimized technology for More than Moore products: The ICV-SLID process enables 3D integration of completely fabricated devices. Reliability issues, as thermo-mechanical stress caused by TSV formation and bonding are considered. The technology choice for the e-CUBES automotive application demonstrator is described.