Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

Author

Akkermans, J.A.G. ; Kazim, M.I. ; Yu, Y. ; Herben, M.H.A.J. ; Baltus, P.G.M. ; Smulders, P.F.M.

Author_Institution

Electr. Eng., Eindhoven Univ. of Technol. (TU/e), Eindhoven

fYear

2009

fDate

23-27 March 2009

Firstpage

2818

Lastpage

2822

Abstract

The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.

Keywords

CMOS integrated circuits; antenna radiation patterns; flip-chip devices; integrated circuit interconnections; millimetre wave antennas; millimetre wave power amplifiers; printed circuits; PCB package technology; antenna gain; antenna radiation pattern; differential CMOS power amplifier; flip-chip integration; frequency 60 GHz; mechanical rigidity; printed circuit-board technology; reliable low-loss interconnect; Antenna measurements; CMOS technology; Differential amplifiers; Frequency; Gain measurement; Integrated circuit interconnections; Integrated circuit reliability; Packaging; Performance gain; Power amplifiers;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation, 2009. EuCAP 2009. 3rd European Conference on

Conference_Location

Berlin

Print_ISBN

978-1-4244-4753-4

Electronic_ISBN

978-3-00-024573-2

Type

conf

Filename

5068196