• DocumentCode
    494522
  • Title

    Simulation and experiment of PDMS based thermopnuematic microvalve in microfluidic chip

  • Author

    Mongpraneet, Suriya ; Wisitsora-at, Anurat ; Kamnerdtong, Thoatsanope ; Jongpardist, Pattaramon ; Tuantranont, Adison

  • Author_Institution
    Dept. of Mech. Eng., King Mongkut´´s Univ. of Technol., Bangkok, Thailand
  • Volume
    01
  • fYear
    2009
  • fDate
    6-9 May 2009
  • Firstpage
    458
  • Lastpage
    461
  • Abstract
    A thermopneumatic microvalve for switching fluid in a microchannel of PDMS based microfluidic chip was designed and fabricated from multi-stack PDMS structure on a glass substrate. Microvalve structure consists of inlet and outlet, microchannel, a thermopneumatic actuation chamber, and a thin film heater. In microchannel, fluid is blocked or passed by the motion of actuation diaphragm. Actuation diaphragm is bent up and down by exploiting air expansion that is induced by increasing heater temperature. The microvalve was designed and simulated by ABQUS program, mechanical commercial finite element simulation software, to predict its characteristics and optimize the design. The microvalve created for simulation model has a diameter of 2.5 mm and a total height of 450 mum. The microvalve was then fabricated on glass substrate by low cost processes including PDMS spinning, oxygen plasma bonding, electroplated micromasking, and thermal evaporation. The microvalve characteristics were measured as a function of applied voltage and inlet pressure. From the experiment, a maximum inlet pressure of 10 kPa can be applied with 7-17 V applied voltage to the microvalve heater. The leak rate and maximum inlet pressure results obtained from ABQUS program agree well with the experimental data.
  • Keywords
    microchannel flow; microfluidics; microvalves; pneumatic systems; PDMS; actuation diaphragm; microchannel; microfluidic chip; oxygen plasma bonding; polydimethylsiloxane; switching fluid; thermopnuematic microvalve; Glass; Microchannel; Microfluidics; Microvalves; Plasma measurements; Plasma temperature; Predictive models; Substrates; Transistors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, 2009. ECTI-CON 2009. 6th International Conference on
  • Conference_Location
    Pattaya, Chonburi
  • Print_ISBN
    978-1-4244-3387-2
  • Electronic_ISBN
    978-1-4244-3388-9
  • Type

    conf

  • DOI
    10.1109/ECTICON.2009.5137047
  • Filename
    5137047