Optimization of interconnects for signal integrity using self - adaptation in real - parameter genetic algorithms with simulated binary cross over (SBX)

Signal integrity is the ability of a signal to generate correct responses in the circuit. High speed interconnect is the one in which the time taken by the propagating signal to travel between its end points cannot be neglected. High Speed Interconnects are modeled as Planar Transmission Line Structures. Analysis and design of interconnections in high-speed VLSI chips and printed circuit boards are gaining importance because of the rapid increase in operating frequencies and decrease in feature sizes. Improperly designed interconnects can result in increased crosstalk, signal delay, ringing, inadvertent and false switching. In order to reduce adverse signal integrity effects it is necessary for the interconnects to have accurate physical dimensions which as a result reduces unwanted coupling between neighboring conductors of the interconnects. In this paper, Genetic algorithm based approach with SBX to find optimal solution for physical dimensions of High speed interconnects, in the form of coupled micro strip line is presented.