DocumentCode :
4956
Title :
2.7 THz Balanced Waveguide HEB Mixer
Author :
Boussaha, Faouzi ; Kawamura, Jonathan ; Stern, Jeffery ; Jung-Kubiak, Cecile
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Volume :
4
Issue :
5
fYear :
2014
fDate :
Sept. 2014
Firstpage :
545
Lastpage :
551
Abstract :
We report on the development of a waveguide-based balanced superconducting mixer for operation near 2.7 THz. The mixer employs a pair of NbN hot-electron bolometers defined on 6 μm-thick silicon substrate that follows a 90 ° hybrid coupler. To produce the critical structures of the coupler and waveguide embedding circuit, we have utilized silicon micromachining techniques based on deep reactive ion etching. Operating near 4.2 K bath temperature, we have measured a minimum uncorrected DSB receiver noise temperature of less than 2000 K using Callen-Welton formula and local oscillator sideband noise rejection better than 13±3 dB at 2.74 THz. The concept is suitable for building arrays, readily scalable for higher frequencies up 5 THz, and could accommodate other mixer technologies, such as room-temperature Schottky diode mixers.
Keywords :
Schottky diode mixers; bolometers; etching; micromachining; oscillators; Callen-Welton formula; NbN hot-electron bolometers; balanced waveguide HEB mixer; bath temperature; deep reactive ion etching; frequency 2.7 THz; hybrid coupler; local oscillator sideband noise rejection; minimum uncorrected DSB receiver noise temperature; room-temperature Schottky diode mixers; silicon micromachining techniques; temperature 293 K to 298 K; temperature 4.2 K; thick silicon substrate; waveguide embedding circuit; waveguide-based balanced superconducting mixer; Couplers; Mixers; Noise; Optical waveguides; Radio frequency; Receivers; Temperature measurement; Heterodyne detection; hot electron bolometer; hybrid coupler; silicon micromachining; terahertz (THz) frequency; waveguide;
fLanguage :
English
Journal_Title :
Terahertz Science and Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-342X
Type :
jour
DOI :
10.1109/TTHZ.2014.2342507
Filename :
6868292
Link To Document :
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