DocumentCode :
497152
Title :
Rump sessions
fYear :
2009
fDate :
16-18 June 2009
Firstpage :
86
Lastpage :
87
Keywords :
CMOS technology; Electrons; High K dielectric materials; Large scale integration; Lithography; Manufacturing; Nonvolatile memory; Packaging; Scalability; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 2009 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-3308-7
Type :
conf
Filename :
5200588
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=497152
