DocumentCode
497152
Title
Rump sessions
fYear
2009
fDate
16-18 June 2009
Firstpage
86
Lastpage
87
Keywords
CMOS technology; Electrons; High K dielectric materials; Large scale integration; Lithography; Manufacturing; Nonvolatile memory; Packaging; Scalability; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 2009 Symposium on
Conference_Location
Honolulu, HI
Print_ISBN
978-1-4244-3308-7
Type
conf
Filename
5200588
Link To Document