DocumentCode
497197
Title
3D integration for energy efficient system design
Author
Borkar, Shekhar
Author_Institution
Microprocessor Technol. Lab., Intel Corp., Hillsboro, OR, USA
fYear
2009
fDate
16-18 June 2009
Firstpage
58
Lastpage
59
Abstract
3D integration technology provides capability to inexpensively integrate heterogeneous technologies, and improve power/energy efficiency of a system, as demonstrated by the TFLOP system prototype with 3D integrated SRAM.
Keywords
SRAM chips; integrated circuit design; 3D integration technology; SRAM; TFLOP system prototype; energy efficiency; energy efficient system design; heterogeneous technologies; power efficiency; Energy efficiency;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 2009 Symposium on
Conference_Location
Honolulu, HI
Print_ISBN
978-1-4244-3308-7
Type
conf
Filename
5200634
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