Title :
3D integration for energy efficient system design
Author_Institution :
Microprocessor Technol. Lab., Intel Corp., Hillsboro, OR, USA
Abstract :
3D integration technology provides capability to inexpensively integrate heterogeneous technologies, and improve power/energy efficiency of a system, as demonstrated by the TFLOP system prototype with 3D integrated SRAM.
Keywords :
SRAM chips; integrated circuit design; 3D integration technology; SRAM; TFLOP system prototype; energy efficiency; energy efficient system design; heterogeneous technologies; power efficiency; Energy efficiency;
Conference_Titel :
VLSI Technology, 2009 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-3308-7
