DocumentCode :
49761
Title :
On-chip temperature compensation for optical transmitter modules
Author :
Sangirov, J. ; Park, T.-W. ; Ukaegbu, I.A. ; Lee, Tae-Woo ; Park, Hyun-Hee
Author_Institution :
PCS Lab., KAIST, Daejeon, South Korea
Volume :
49
Issue :
3
fYear :
2013
fDate :
Jan. 31 2013
Firstpage :
202
Lastpage :
204
Abstract :
On-chip temperature compensation (TC) for optical transmitter (Tx) modules is reported. The TC block is integrated in common silicon (Si)-substrate with the Tx and demonstrates the ability to maintain a constant VCSEL output light power without an additional monitoring photodiode. Designed and fabricated in a 0.13 μm technology, the Tx with a TC block operates at up to 5 Gbit/s. A BER of less than 10-12 is achieved at a received input power of - 3 dBm, with a 1.3 dBm variation of received power for a temperature increase of 20-100°C at 5 Gbit/s data rate. The percentage error of the temperature compensated Tx output light power is ± 3%. The Tx module consumes a power of 20 mW at 1.3 V, including the TC block.
Keywords :
compensation; error statistics; modules; optical transmitters; photodiodes; surface emitting lasers; BER; Si; Tx module; VCSEL; on-chip temperature compensation; optical transmitter modules; photodiode; size 0.13 mum;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el.2012.3350
Filename :
6457571
Link To Document :
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