• DocumentCode
    500812
  • Title

    Spectrum: A hybrid nanophotonic—electric on-chip network

  • Author

    Li, Zheng ; Fay, Dan ; Mickelson, Alan ; Shang, Li ; Vachharajani, Manish ; Filipovic, Dejan ; Park, Wounjhang ; Sun, Yihe

  • Author_Institution
    Tsinghua Nat. Lab. for Inf. Sci. & Technol., Tsinghua Univ., Beijing, China
  • fYear
    2009
  • fDate
    26-31 July 2009
  • Firstpage
    575
  • Lastpage
    580
  • Abstract
    On many-core chip designs, short, often-multicast, latency-critical messsages, used extensively in high-level coherence and synchronization protocols, often become the bottleneck of parallel performance scaling. This paper presents Spectrum, a hybrid nanophotonic-electric on-chip network that optimizes both throughput and latency. Spectrum´s novel planar nanophotonic subnetwork broadcasts latency-critical messages through a wavelength-division multiplexed (WDM) two-dimensional waveguide. Spectrum´s throughput-optimized packet-switching electrical subnetwork handles high bandwidth traffic. Overall, Spectrum delivers an almost ideal CMOS-compatible interconnection network for many-core systems.
  • Keywords
    multiprocessor interconnection networks; nanophotonics; network-on-chip; optical communication; protocols; wavelength division multiplexing; CMOS-compatible interconnection network; Spectrum; high-level coherence protocol; hybrid nanophotonic-electric on-chip network; latency-critical messsages; parallel performance scaling; planar nanophotonic subnetwork; synchronization protocol; throughput-optimized packet-switching electrical subnetwork; two-dimensional waveguide; wavelength-division multiplexing; Bandwidth; Broadcasting; Chip scale packaging; Coherence; Delay; Network-on-a-chip; Planar waveguides; Protocols; Throughput; Wavelength division multiplexing; Networks-on-Chip; optical communication; silicon photonics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2009. DAC '09. 46th ACM/IEEE
  • Conference_Location
    San Francisco, CA
  • ISSN
    0738-100X
  • Print_ISBN
    978-1-6055-8497-3
  • Type

    conf

  • Filename
    5227067