DocumentCode
500822
Title
Thermal-aware data flow analysis
Author
Ayala, José L. ; Atienza, David ; Brisk, Philip
Author_Institution
DACYA, Complutense Univ. of Madrid, Madrid, Spain
fYear
2009
fDate
26-31 July 2009
Firstpage
613
Lastpage
614
Abstract
This paper suggests that the thermal state of a processor can be approximated using data flow analysis. The results of this analysis can be used to evaluate the efficacy of thermal-aware compilation strategies, or as input to thermal-aware optimizations that occur in the early stages of back-end compilation. We propose different ways how the exploitation of thermal behavior knowledge can be included in the different compilation phases.
Keywords
data flow analysis; optimising compilers; back-end compilation; processor thermal state; thermal behavior knowledge; thermal-aware compilation strategy; thermal-aware compiler optimization; thermal-aware data flow analysis; Computer architecture; Data analysis; Information analysis; Permission; Power system management; Radio frequency; Registers; Semiconductor devices; Temperature; Thermal management; Compiler; Thermal Management;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2009. DAC '09. 46th ACM/IEEE
Conference_Location
San Francisco, CA
ISSN
0738-100X
Print_ISBN
978-1-6055-8497-3
Type
conf
Filename
5227078
Link To Document