• DocumentCode
    501404
  • Title

    Fault Simulation for the Electrostatic Parallel-Plate Micro-actuator

  • Author

    Hao, Yongping ; Liu, Fengli

  • Author_Institution
    R&D Center of CAD/CAM Technol., Shenyang Ligong Univ., Shenyang, China
  • Volume
    1
  • fYear
    2009
  • fDate
    15-17 May 2009
  • Firstpage
    614
  • Lastpage
    617
  • Abstract
    The fault analysis for the electrostatic parallel-plate is a critical issue in the design flow, as it played an important role in determining device reliability and the voltage required for successful operation. The simulations for pull-in and release voltages were carried in CoventorWare. The FEM model was constructed. The displacement of the upper electrode and corresponding capacitance between the upper and bottom electrode at different voltage are studied. The contact force and the stresses in the movable structure were presented. Electrostatic spring softing analysis interpreted the shift at the resonant frequencies.
  • Keywords
    design engineering; electrostatic actuators; fault diagnosis; finite element analysis; reliability; CoventorWare; design flow; device reliability; electrostatic parallel plate; fault analysis; finite element method; microactuator; Analytical models; Electrodes; Electrostatic actuators; Electrostatic analysis; Information technology; Iron; Microactuators; Micromechanical devices; Springs; Voltage; MEMS; parallel-plate micro-actuator; reliability; simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Technology and Applications, 2009. IFITA '09. International Forum on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-0-7695-3600-2
  • Type

    conf

  • DOI
    10.1109/IFITA.2009.549
  • Filename
    5231715