Title :
Integration of TLP analysis for ESD troubleshooting
Author :
Ting, Li-Moum ; Duvvury, Charvaka ; Trevino, O. ; Schichl, Joe ; Diep, Tom
Author_Institution :
MAKE Quality & Reliability Eng., Texas Instrum., Dallas, TX, USA
Abstract :
In the present work, we have integrated TLP analysis into our troubleshooting efforts for product-level ESD protection designs. We have demonstrated the application of the TLP analysis to understand a unique HBM ESD failure and to arrive at the necessary corrective actions to optimize the product ESD design.
Keywords :
electrostatic discharge; failure analysis; transmission lines; ESD troubleshooting; PMOS structures; human body model ESD failure; transmission line pulsing; Electrostatic discharge; Leakage current; Oscilloscopes; Packaging; Product design; Protection; Stress; Testing; Transistors; Voltage;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2001. EOS/ESD '01.
Conference_Location :
Portland, OR
Print_ISBN :
978-1-5853-7039-9
Electronic_ISBN :
978-1-5853-7039-9
