DocumentCode :
501908
Title :
Controlling ESD damage of ICs at various steps of back-end process
Author :
Marley, John ; Tan, David ; Kraz, Vladimir
Author_Institution :
Xilinx, Inc., San Jose, CA, USA
fYear :
2001
fDate :
11-13 Sept. 2001
Firstpage :
119
Lastpage :
123
Abstract :
In this work we study the methodology of ESD Event identification and their correlation with operation of equipment at various stages of the back end IC manufacturing. Survey of ESD environment in terms of exposure of ICs to known strength of ESD Events is described. Such correlation is instrumental in identification of sources of ESD damage and in setting up and maintaining ESD-safe environment.
Keywords :
electrostatic discharge; integrated circuit manufacture; occupational safety; ESD Event identification; ESD damage control; ESD-safe environment; back end IC manufacturing; electrostatic discharge; Costs; Electrostatic discharge; Energy measurement; Fault location; Logic; Manufacturing; Pins; Protection; Pulse measurements; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2001. EOS/ESD '01.
Conference_Location :
Portland, OR
Print_ISBN :
978-1-5853-7039-9
Electronic_ISBN :
978-1-5853-7039-9
Type :
conf
Filename :
5254981
Link To Document :
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