Title :
An analysis of ESD packaging systems through thermoforming
Author_Institution :
VPI Mirrex Corp., Delaware City, DE, USA
Abstract :
In the packaging industry, from folding cartons to bags and clamshells, various packaging configurations are available to the end-user. This paper explores the factors involved in producing the electrostatic dissipative (ESD) effect and its benefit in the clamshell blister segment by equating differences before and after thermoforming of the ESD article.
Keywords :
electrostatic discharge; forming processes; plastic packaging; ESD packaging systems; clamshell blister segment; electrostatic dissipative effect; packaging industry; thermoforming; Additives; Electrostatic discharge; Friction; Lubricants; Packaging; Polymer films; Substrates; Surface resistance; Temperature; Thermoforming;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2001. EOS/ESD '01.
Conference_Location :
Portland, OR
Print_ISBN :
978-1-5853-7039-9
Electronic_ISBN :
978-1-5853-7039-9
