• DocumentCode
    501915
  • Title

    An analysis of ESD packaging systems through thermoforming

  • Author

    Allen, Jason

  • Author_Institution
    VPI Mirrex Corp., Delaware City, DE, USA
  • fYear
    2001
  • fDate
    11-13 Sept. 2001
  • Firstpage
    44
  • Lastpage
    49
  • Abstract
    In the packaging industry, from folding cartons to bags and clamshells, various packaging configurations are available to the end-user. This paper explores the factors involved in producing the electrostatic dissipative (ESD) effect and its benefit in the clamshell blister segment by equating differences before and after thermoforming of the ESD article.
  • Keywords
    electrostatic discharge; forming processes; plastic packaging; ESD packaging systems; clamshell blister segment; electrostatic dissipative effect; packaging industry; thermoforming; Additives; Electrostatic discharge; Friction; Lubricants; Packaging; Polymer films; Substrates; Surface resistance; Temperature; Thermoforming;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2001. EOS/ESD '01.
  • Conference_Location
    Portland, OR
  • Print_ISBN
    978-1-5853-7039-9
  • Electronic_ISBN
    978-1-5853-7039-9
  • Type

    conf

  • Filename
    5254988
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=501915