Title :
Is CO2 bubbling (carbonation) a requirement at semiconductor wafer sawing process
Author :
Yan, K.P. ; Gaertner, R. ; Ng, K.K.
Author_Institution :
Infineon Technol. (Malaysia) Sdn. Bhd., Batu Berendam, Malaysia
Abstract :
To avoid contamination of wafers, ultra-clean, de-ionized (DI) water is used in the wafer sawing process as a cleaning media and lubricant. There are claims that the high resistivity of DI water creates static charges that cause damaging ESD voltages. Investigations are conducted, and results and conclusions are presented.
Keywords :
sawing; semiconductor technology; bubbling; carbonation; cleaning media; lubricant; semiconductor wafer sawing; Cleaning; Conductivity; Electric resistance; Electrical resistance measurement; Electrostatic discharge; Lubricants; Measurement units; Pollution measurement; Sawing; Water pollution;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2006. EOS/ESD '06.
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-5853-7115-0
