• DocumentCode
    502585
  • Title

    Is CO2 bubbling (carbonation) a requirement at semiconductor wafer sawing process

  • Author

    Yan, K.P. ; Gaertner, R. ; Ng, K.K.

  • Author_Institution
    Infineon Technol. (Malaysia) Sdn. Bhd., Batu Berendam, Malaysia
  • fYear
    2006
  • fDate
    10-15 Sept. 2006
  • Firstpage
    253
  • Lastpage
    259
  • Abstract
    To avoid contamination of wafers, ultra-clean, de-ionized (DI) water is used in the wafer sawing process as a cleaning media and lubricant. There are claims that the high resistivity of DI water creates static charges that cause damaging ESD voltages. Investigations are conducted, and results and conclusions are presented.
  • Keywords
    sawing; semiconductor technology; bubbling; carbonation; cleaning media; lubricant; semiconductor wafer sawing; Cleaning; Conductivity; Electric resistance; Electrical resistance measurement; Electrostatic discharge; Lubricants; Measurement units; Pollution measurement; Sawing; Water pollution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2006. EOS/ESD '06.
  • Conference_Location
    Anaheim, CA
  • Print_ISBN
    978-1-5853-7115-0
  • Type

    conf

  • Filename
    5256771
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=502585