• DocumentCode
    502619
  • Title

    ESD damage due to HBM stressing of non-connected pins

  • Author

    Kaschani, K.T. ; Schimon, M. ; Hofmann, M. ; Wilson, M.W. ; Koch, A.

  • Author_Institution
    Atmel Germany GmbH, Heilbronn, Germany
  • fYear
    2006
  • fDate
    10-15 Sept. 2006
  • Firstpage
    14
  • Lastpage
    23
  • Abstract
    An ESD damage due to HBM stressing of a non-connected pin is introduced. The failure mechanism is investigated and discussed. As a result, four different possible sources for a sparkover between non-connected and regular pins are introduced. Finally, possible countermeasures are discussed and recommendations are given to avoid similar failures.
  • Keywords
    automotive electronics; electrostatic discharge; failure analysis; integrated circuit design; ESD damage; HBM stressing; automotive applications; failure mechanism; integrated circuit design; nonconnected pins; Application specific integrated circuits; Current measurement; Electrostatic discharge; Failure analysis; Packaging; Pins; Protection; Stress; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2006. EOS/ESD '06.
  • Conference_Location
    Anaheim, CA
  • Print_ISBN
    978-1-5853-7115-0
  • Type

    conf

  • Filename
    5256806
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=502619